Semiconductor Packaging and Assembly Equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit. This involves wire bonding, die-bonding, and dicing. Also, it is a back-end process of chip formation. Semiconductor chip assembly is also a key component of the semiconductor supply chain.
The increase in application of semiconductor ICs across many segments has increased the demand for semiconductor packaging and assembly equipment. The growth in complexity of semiconductor IC designs majorly drives the market. Recently, it has been observed that there is an increase in the need for semiconductor ICs that can perform multiple functions. Consequently, vendors have developed semiconductor ICs with complex architecture to address the rise in need for multi-functional ICs. The development of complex semiconductor ICs is a critical factor that impels the market growth during the forecast period.
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Major companies profiled in the report include Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics Co Ltd., Jiangsu Changjiang Electronics Technology Co., Ltd., ChipMOS Technologies Inc., Powertech Technologies Inc., and ASE Group.
- Comprehensive market analysis of the current trends and future estimations is provided from 2017-2025.
- The report offers a competitive scenario of the market with growth trends, structure, driving factors, scope, opportunities, and challenges.
- The report includes a detailed analysis of the key segments to provide insights on market dynamics.
Semiconductor Packaging and Assembly Equipment Market Key Segmentation:
- Plating Equipment
- Inspection and Dicing Equipment
- Wire Bonding Equipment
- Die-Bonding Equipment
- Inspection and Dicing Equipment
- Consumer Electronics
- Healthcare Devices
- Automotive Application
- Enterprise Storage
- Industrial Applications
- Amkor Technology Inc.
- Fujitsu Ltd.
- Toshiba Corporation
- Qualcomm Incorporated
- Renesas Electronics Corporation
- Samsung Electronics Co Ltd.
- ChipMOS Technologies Inc.
- Powertech Technologies Inc.
- ASE Group
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