Global Semiconductor Assembly and Testing Service Market, By Service (Assembly, Packaging, Testing), By Application (Consumer Electronics, Information Technology, Telecommunication, Automotive, Industrial) — Forecast till 2022
Semiconductor Assembly and Testing Services (SATS) Market Research Report- Global Forecast 2022
Global Semiconductor Assembly and Testing Services Market is growing significantly. High development in the field of technology, need of efficient consumer electronic products, changing trends and high adoption automation into the manufacturing process are some of the key drivers for the market of Semiconductor Assembly and Testing Services.
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Today, the semiconductor industry is more than of USD 400 billion and with the rise in the spending in investment in the in development of new products, the market will continue to show the positive growth rate in the coming picture. This is the main factor which is driving the market of semiconductor assembly and testing services whereas changing technological environment, government rules towards the use of ecofriendly environment and e-wastage is expected to hinder the market growth during forecast period.
The global Semiconductor Assembly and Testing Services market is expected to grow at USD ~43 billion by the end of year 2022 with ~5% of CAGR.
Today, the market of semiconductor products is increasing at exponential rate. High consumption of products in the different regions is giving huge pressure on the OEMs. As the technology is growing, the average life cycle of products is decreasing due to the availability of substitutes. For the expansion and business growth, companies are adopting multiple business strategies including mergers and acquisition. In last five years, the R&D expense of companies has increased tremendously due to the increase in the revenue and growing competition. Market Research Future has predicted that Asia-Pacific is dominating the market of Semiconductor Assembly and Testing Services due to the rich presence of semiconductor manufacturing companies in China, Japan, South Korea and Taiwan.
For the purpose of this study, Market Research Future has segmented the market of Semiconductor Assembly and Testing Services into Services and Application. Services includes assembly, packaging and testing whereas the applications has been segmented as consumer electronics, IT, Telecommunication, Automotive, Industrial among others.
Advanced Semiconductor Engineering, Inc. (U.S.), Amkor Technology, Inc. (U.S.), Siliconware Precision Industries Co., Ltd. (Taiwan), STATS ChipPAC Ltd (Signapore), Powertech Technology Inc. (Taiwan), CORWIL Technology (U.S.), Chipbond Technology Corporation (U.S.), Integrated Micro-Electronics, Inc. (U.S.), Global Foundries (U.S.) among others are some of the prominent players profiled in MRFR Analysis and are at the forefront of competition in the Global Semiconductor Assembly and Testing Services (SATS) Market.
The Global Semiconductor Assembly and Testing Services (SATS) is segmented in to 4 key dynamics for the convenience of the report and enhanced understanding;
Segmentation by Services: Comprising assembly, packaging and testing.
Segmentation by Application: Comprising consumer electronics, Information technology, telecommunications and automotive industrial.
Segmentation by Packaging Solution: Comprises Copper wire and gold wire bonding, Copper clip, Flip chip, Wafer level packaging, TSV.
Segmentation by Regions: Comprises Geographical regions — North America, Europe, APAC and Rest of the World.
Semiconductor Assembly and Testing Services (SATS) global market is expected to be dominated by Asia Pacific with the largest market share due to high development in field of manufacturing industry and high presence of semiconductor manufacturing companies gives a competitive advantage over other regions.
North America stands as second biggest market for Semiconductor Assembly and Testing Services where U.S. is the major contributors in the market growth due to the growing telecommunication and IT industry. Asia-Pacific is also expected to be the fastest growing market during the forecast period. The economic developments of Asian countries is inviting major big players to establish their business unit in Asian Countries.
Industry/ Innovation/ Related News:
May 24, 2017 — Amkor Technology Inc. recently completed the acquisition of Europe’s largest OSATS (Outsourced Semiconductor Assembly and Test Services) company, Nanium S.A. Portugal-based Nanium provides semiconductor assembly, packaging, test, engineering and manufacturing services. Their solutions include package designing, wafer-level packaging (WLP), wafer probe, assembly and test, supply-chain management and drop shipping. The deal is a step on Nanium’s part to enhance the use of WLFO technology to expand its market share in the packaging market. By leveraging Nanium’s technology, Amkor will be able to strengthen its foothold in the fast-growing market of wafer-level packaging for smartphones, tablets and other applications. Management believes that the deal could expand Nanium’s scale of manufacturing, thereby increasing the company’s customer base.
November, 2017 — Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have finally received all anti-trust approvals for the proposed and long-awaited merger between the two IC packaging houses. The combination of ASE and SPIL will also enable the two companies to share R&D and product development. ASE, SPIL and other OSATs have seen an increase in R&D costs, particularly in the development of advanced packaging. Fewer OSATs can afford to make the necessary investments in advanced packaging, a move that is fueling the merger and acquisition activity in the arena.
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