Semiconductor Bonder Machine Market To Be Driven By The Continually Growing Consumer Electronics Sector Worldwide
According to a new market research report published by Credence Research “Semiconductor Bonder Machine Market (Type – Wire Bonder and Die Bonder; Application – Integrated Device Manufacturer (IDMs) and Outsourced Semiconductor Assembly and Test (OSATs)) – Growth, Future Prospects and Competitive Analysis, 2019 - 2027”, the overall semiconductor bonder machine market worldwide was valued at US$ 1,558.54 Mn in 2018 and is set to grow with a CAGR of 4.02% during the forecast period.
The rising adoption of the several advanced technologies in equipment segment in the chip packaging or the encapsulation is majorly backing to the growth of the semiconductor bonder machine market. Additionally, growing research and development in the electronics sector for the purpose of providing smaller, affordable, lighter and efficient products are expected to boost the market demand for semiconductor bonder machine market in the coming years. Rapidly growing adoption of the semiconductor bonder machines in integrated Device Manufacturers and the Outsourced Semiconductor Assembly and Testing are projected to serve multiple growth opportunities in semiconductor bonder machine market over the forecast period.
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Based on type, wire bonder machine is projected to maintain fastest growth during the forecast period. Dominant market position in the Copper has permitted market share expansion for wire bonder machine and helped to maintain high market share in the overall semiconductor bonder machine market. Further, based on application, Integrated Device Manufacturers Use in the advanced packaging in is trending nowadays.
Some of the major companies profiled in the report include Kulicke& Soffa , DIAS Automation, ASM Pacific Technology , Palomar Technologies, F&K Delvotec Bondtechnik , Hybond , Hesse , SHINKAWA Electric ,Panasonic, Toray Engineering , FASFORD TECHNOLOGY and West-Bond among others.